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P01900 - SEMI P19 - 集積回路製造用メトロロジパターンセル Revision:SEMI P19-92 (Reapproved 0707) - Inactive The purpose of this Specification

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Description

The purpose of this Specification is to standardize requirements for buffered oxide etchants used in the semiconductor industry and testing procedures to support those standards

SEMI MF928-0314 (technical revision)

The purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process

2-95 (Withdrawn 1109)

P01900 - SEMI P19 - 集積回路製造用メトロロジパターンセル Revision:SEMI P19-92 (Reapproved 0707) - Inactive The purpose of this Specificationglobal Micropatterning Committee2007425global Audits and Reviews Subcommittee20076www. semi. org20077CD ROM19921996 Referenced SEMI Standards SEMI P24 CD Metrology Procedures

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