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High-temp FFF Gluestick Material = Copper 32 Bending modulus (MPa) (Z)

SKU: 17243069407

4.3
USD19.95 USD41.95

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Description

32 Bending modulus (MPa) (Z) Modified ASTM D790 (ISO 178

stiffness and heat resistance

household appliances

Extruder Temp:  Typically 210-220°C

High-temp FFF Gluestick Material = Copper 32 Bending modulus (MPa) (Z)For materials inc. PEEK.

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